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| EN71PL032A0 EN71PL032 Base MCP Stacked Multi-Chip Product (MCP) Flash Memory and RAM 32 Megabit (2M x 16-bit) CMOS 3.0 Volt-only Simultaneous Operation Page Mode Flash Memory and 16 Megabit (1M x 16-bit) Pseudo Static RAM Distinctive Characteristics MCP Features Power supply voltage of 2.7 V to 3.3V High performance - 70 ns Package - 7 x 9 x 1.2mm 56 ball FBGA Operating Temperature - 25C to +85C General Description The EN71PL series is a product line of stacked Multi-Chip Product (MCP) packages and consists of: EN29PL032 (Simultaneous Read/Write) Flash memory die. Pseudo SRAM. For detailed specifications, please refer to the individual datasheets listed in the following table. Device NOR Flash Pseudo SRAM Document EN29PL032 EN_EM1 Product Selector Guide 32Mb Flash Memory Device-Model# EN71PL032A0 Flash Access time (ns) 70 pSRAM density 16M pSRAM pSRAM Access time (ns) 70 Package 56 FBGA This Data Sheet may be revised by subsequent versions 1 or modifications due to changes in technical specifications. (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. B, Issue Date: 2008/09/10 EN71PL032A0 MCP Block Diagram This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 2 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. B, Issue Date: 2008/09/10 EN71PL032A0 Connection Diagram MCP EN71PL032A0 Flash-only Addresses A20 Shared Addresses A19 - A0 This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 3 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. B, Issue Date: 2008/09/10 EN71PL032A0 Pin Description Signal A20-A0 DQ15-DQ0 CE1#f CE1#ps CE2ps OE# WE# RY/BY# UB# LB# RESET# WP#/ACC VCCf VCCps VSS NC Description 21 Address Inputs (Common) 16 Data Inputs/Outputs (Common) Chip Enable 1 (Flash) Chip Enable 1 (pSRAM) Chip Enable 2 (pSRAM) Output Enable (Common) Write Enable (Common) Ready/Busy Output (Flash) Upper Byte Control (pSRAM) Lower Byte Control (pSRAM) Hardware Reset Pin, Active Low (Flash) Hardware Write Protect/Acceleration Pin (Flash) Flash 3.0 volt-only single power supply pSRAM Power Supply Device Ground (Common) Pin Not Connected Internally Logic Symbol This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 4 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. B, Issue Date: 2008/09/10 EN71PL032A0 ORDERING INFORMATION EN71PL032 A0 70 C W P PACKAGING CONTENT (Blank) = Conventional P = Pb Free TEMPERATURE RANGE W = Wireless (-25C to +85C) PACKAGE C =56-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 7mm x 9mm package SPEED 70 = 70ns pSRAM density A0 = 16M pSRAM BASE PART NUMBER EN = Eon Silicon Solution Inc. 71PL = Multi-chip Product (MCP) 3.0V Simultaneous Read/Write, Page Mode Flash Memory and RAM 032 = 32 Megabit (2M x 16) This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 5 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. B, Issue Date: 2008/09/10 EN71PL032A0 PACKAGE MECHANICAL 56-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package SYMBOL A A1 A2 D E D1 E1 e DIMENSION IN MM MIN. --0.25 0.61 6.90 8.90 ------NOR --0.30 0.66 7.00 9.00 5.60 5.60 0.80 0.40 MAX 1.20 0.35 0.71 7.10 9.10 ------0.45 b 0.35 Note : 1. Coplanarity: 0.1 mm This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 6 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. B, Issue Date: 2008/09/10 EN71PL032A0 Revisions List Revision No A B Description Date Initial Release 2008/04/08 1. Update MCP Block Diagram in page 2 and Pin Description in page 4. 2008/09/10 2. Remove the individual datasheet descriptions of EN29PL064/032 and EN_EM566168GD from Vision A. This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 7 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. B, Issue Date: 2008/09/10 |
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